Mesh-AI Limited
Buro Happold group.
Buro Happold group.
Buro Happold group.
Tractebel Engie Group
Kier Group plc
Anthony Best Dynamics Limited.
Connect with headhunters to apply for similar jobsLily Lifestyle
Signet Jewelers Ltd.
MWH Treatment Limited
Mesh-AI Limited
Philips Magyarország
Highways Magazine
Warner Bros Games
Cdfam Computational Design Symposium
Pod-Trak Ltd
Connected Local Government
Buro Happold group.
Mercy Corp
Stride Treglown
A cutting-edge technology company in Bristol is looking for a Thermal Engineer to design advanced cooling systems for high-density AI hardware. The ideal candidate should have a Bachelor's degree in Mechanical Engineering and over 7 years of experience in thermal design. Responsibilities include leading the development of cooling architectures, collaborating with suppliers, and ensuring manufacturability and reliability of designs. A strong emphasis on teamwork and effective communication is essential. The company promotes a collaborative culture with opportunities for rapid innovation.
Fractile is building silicon, systems and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost. We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale.
We are seeking a Thermal Engineer with deep experience in data centre or high‑density system design, someone who can guide and shape the development of advanced cooling architectures. You might be a mechanical engineer who has specialised in thermal design, or a thermal systems expert with strong modelling and integration experience. Either way, you’ll be comfortable leading design direction and working hands‑on with suppliers, prototypes, and test rigs. We are open to a contractor or permanent hires, we are most interested in finding someone who can add real expertise when it’s needed, help define the right path, and guide the build of a robust, production‑ready cooling solution.
You will lead the design of an advanced cooling system for a high‑density AI accelerator system destined for data centre deployment. This includes developing the full cooling architecture — from Direct‑to‑Chip (D2C) liquid cooling through to rack‑level thermal management and hybrid liquid‑air solutions for host chassis. You’ll collaborate closely with mechanical engineers (internal and external), chip and board designers, and 3rd‑party suppliers to define requirements, review designs, and ensure that every aspect of the system — from the cold plate up — meets performance, reliability, and manufacturability goals. We expect you to bring a mix of technical authority, practical design sense, and strong supplier management skills. You may also lead or advise on the development of a thermal test platform to validate solutions in real‑world conditions.
Certain roles may involve working on technologies subject to export restrictions. Applicants may be required to undergo additional eligibility checks to ensure compliance with applicable law.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.