Electrical Packaging Engineer

Salience Labs Ltd; Oxford; On-site; GBP 50,000 - 70,000; Full time

Job summary

A leading photonic solutions company in the UK is seeking an Electrical Packaging Engineer to design and deliver complex packaging solutions for photonic and electronic modules. Responsibilities include leading packaging design, coordinating with suppliers, and executing strategic planning for production. The ideal candidate will have experience in semiconductor packaging and excellent communication skills.

Qualifications

• Strong background in electrical packaging for large-scale semiconductor devices.
• Experience with high bump-count, large-area chip packaging.
• Proven ability to manage packaging deliverables effectively.

Responsibilities

• Lead the definition, design, and execution of electrical packaging solutions.
• Collaborate with optical packaging, manufacturing, and hardware teams.
• Define and execute test plans for thermal performance and reliability.

Skills

Electrical packaging expertise

Supplier engagement

Cross-functional coordination

Thermal management techniques

Excellent communication skills

Job description

Join to apply for the Electrical Packaging Engineer role at Salience Labs

As an Electrical Packaging Engineer at Salience Labs, you will be responsible for driving the design and delivery of complex electrical packaging solutions for our photonic and electronic modules. This is a critical role in shaping our products as they transition from R&D into high-volume production. You will lead the packaging deliverable, working closely with our optical packaging, hardware, and manufacturing partners to ensure robust, high-yield solutions that meet performance, thermal, and reliability requirements. This role blends deep technical expertise in electrical packaging with the ability to manage deliverables, coordinate suppliers, and anticipate manufacturing challenges. You will take a hands-on approach while also owning the strategic planning and execution for packaging activities. The ideal candidate has worked across both design and production environments, understands the nuances of large-scale chip packaging, and is motivated to help define how next-generation optical systems are packaged, tested, and brought to market.

Responsibilities

• Lead the definition, design, and execution of electrical packaging solutions for photonic-electronic modules.
• Collaborate with optical packaging, manufacturing and hardware teams to integrate mechanical, thermal, and electrical requirements.
• Specify and oversee interposer designs, substrate layouts, and attachment methodologies.
• Own packaging deliverables from concept to production, including supplier coordination, documentation, and verification.
• Define and execute test plans for thermal performance, mechanical stress, reliability, and compliance.
• Troubleshoot packaging challenges, develop mitigation strategies, and drive yield improvements.
• Work closely with manufacturing partners, both locally and overseas, to ensure manufacturability and cost efficiency.

Qualifications

• Strong background in electrical packaging for large-scale semiconductor devices, including substrate and interposer design.
• Experience with high bump-count, large-area chip packaging and associated manufacturing workflows.
• Proven ability to manage packaging deliverables, including supplier engagement and cross-functional coordination.
• Knowledge of mechanical stress, warpage, thermal management, and yield improvement techniques.
• Comfortable working hands-on with prototypes and in a lab environment.
• Excellent communication skills, able to convey technical requirements to internal teams and suppliers.

Even Better If You

• Have experience integrating photonic and electronic packaging in a single module.
• Are familiar with advanced packaging techniques, such as 2.5D interposers, chip-on-substrate, or wafer-level packaging.
• Have worked with suppliers overseas and understand international manufacturing processes.
• Bring experience from both design engineering and production/manufacturing environments.
• Have led packaging projects from concept through to successful product launch.

Salience is a leader in photonic solutions targeting connectivity for AI data center and financial trading infrastructure. Founded in 2021 and backed by over a decade of research from the University of Oxford in the UK and University of Münster in Germany, Salience’s innovative developments in photonic switching technology enable high-speed, ultra-low latency networking fabrics that remove infrastructure bottlenecks for AI workloads.