Senior/Principal Packaging Engineer - GaN Power (Hybrid)

Dubizzle Limited; Cambridge; Hybrid; GBP 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Cambridge is seeking a Senior Packaging / Principal Packaging Engineer to develop innovative solutions for GaN power products. This role involves leading technical development, collaborating with multidisciplinary teams, and conducting advanced simulations. Ideal candidates will have a degree in Engineering or related fields and extensive experience with 3D Multiphysics Simulation and semiconductor packaging qualification. The company offers a collaborative environment, competitive salary, and multiple benefits including flexible working options.

Benefits

Excellent salary

Share options scheme

Pension scheme (6% Company contribution)

Life Assurance (3x Salary)

BUPA Private Medical Insurance

Annual leave allowance of 33 days

Training and development

Flexible working options

Regular social events

Qualifications

• Solid experience with 3D Multiphysics Simulation for thermal, electrical and stress analysis.
• Experience in producing designs according to supplier design rules using modern 3D CAD tools.
• Good experience with semiconductor packaging qualification tests according to standards.

Responsibilities

• Lead technical development of high performance packaging solutions for GaN power products.
• Collaborate with internal and external teams for product roadmap support.
• Conduct multiphysics simulations to analyze thermal and stress performance.

Skills

3D Multiphysics Simulation

Thermal characterisation of semiconductor packages

Problem-solving skills

Education

Bachelor’s degree in Engineering, Physics, Material Sciences or related subject

Tools

SolidWorks

COMSOL

ANSYS

Job description

A leading semiconductor company in Cambridge is seeking a Senior Packaging / Principal Packaging Engineer to develop innovative solutions for GaN power products. This role involves leading technical development, collaborating with multidisciplinary teams, and conducting advanced simulations. Ideal candidates will have a degree in Engineering or related fields and extensive experience with 3D Multiphysics Simulation and semiconductor packaging qualification. The company offers a collaborative environment, competitive salary, and multiple benefits including flexible working options.