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Microelectronics Wire Bonder - Chelmsford, MA - Interim Secret Required

dommagazine

Chelmsford

On-site

GBP 30,000 - 46,000

Full time

30+ days ago

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Job summary

A leading technology company in Chelmsford is looking for a Microelectronics Wire Bonder for a contract position. The role involves fabricating components, ensuring quality with precision tools, and requires attention to detail. Candidates must possess a high school diploma and familiarity with bonding processes. This position may lead to long-term employment. Benefits include direct deposit, 401(k), and medical coverage.

Benefits

401(k)
Paid holidays
Medical coverage

Qualifications

  • Familiarity with bonding microelectronic components and manual bonding.
  • Strong work ethic and reliability.
  • Ability to learn J-STD-001 and IPC-A-610.

Responsibilities

  • Fabricate microelectronic components using bonding machines.
  • Read and interpret work instructions.
  • Maintain accurate data entry related to production.

Skills

Bonding microelectronic components
Attention to detail
Basic computer skills
Ability to follow instructions
Knowledge of ESD procedures

Education

High school diploma or GED

Tools

Manual and automatic bonding equipment
Microscopes
Hand tools
Job description
Overview

Microelectronics Wire Bonder – Chelmsford, MA – Interim Secret Required. Contract position with potential for long-term employment with a leading technology company.

Location: Chelmsford, MA. Schedule: First Shift, Full-Time (M-TH) 6:00 AM – 4:30 PM.

Employer: PDS Defense, Inc.

Note: Interim Secret required for this role.

Responsibilities
  • Fabricate microelectronic components and sub-assemblies by following instructions for wire and ribbon bonding using manual and automatic bonding machines.
  • Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
  • Read and interpret assembly/process work instructions.
  • Handle components that may vary in size, using visual magnification as needed for the full shift.
  • Use hand tools (tweezers, rulers, cutters) and pneumatic tools (torque drivers, screwdrivers).
  • Maintain accurate data entry related to production processes.
  • Collaborate with team members to improve throughput and support continuous improvement.
Qualifications
  • Familiarity with bonding microelectronic components and with manual gold ball and ribbon bonding.
  • Familiarity with manual and automatic bonding equipment.
  • Basic computer skills, including navigating digital systems for timekeeping, work instructions, and task confirmation.
  • Strong attention to detail and ability to work in a fast-paced environment.
  • Ability to follow written and verbal instructions.
  • Ability to learn J-STD-001 and/or IPC-A-610.
  • Knowledge of ESD procedures and test equipment.
  • Strong work ethic, punctuality, reliability, and desire to grow in the role.
  • High school diploma or GED required.
  • Requires Interim Secret clearance.
Benefits

Benefits vary by contract. Depending on assignment, benefits may include direct deposit, 401(k), paid holidays, disability insurance, training, referral bonuses, medical coverage, and DailyPay (in some locations). Discuss full details with your recruiter.

PDS Defense, Inc. is committed to equal employment opportunities and reasonable accommodation. If you need special assistance or an accommodation during the hiring process, please call 1-866-224-2745. We post information on pay equality and nondiscrimination as required by law. As a federal contractor, the company participates in the E-Verify program to confirm eligibility to work in the United States.

The Company will consider qualified applicants with arrest and conviction records. For more information, please see our candidate privacy information statement at the company site.

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